Amkor secured advance payment agreements from 12 customers to fund capacity.
Computing revenue grew 25% sequentially to achieve a new record.
Amkor broke ground on two buildings to expand Korea clean rooms.
On its third-quarter 2026 earnings call, held on Oct. 26, 2026, Amkor (NASDAQ:AMKR) announced record revenue in both its Computing and Automotive and Industrial end markets. Customer advance payments are providing visibility as the business expands capacity for artificial intelligence (AI) chip assembly.
Three things management said stand out.
Capital expenditure (CapEx), money spent on physical infrastructure, is stepping up as semiconductor packaging becomes critical to artificial intelligence hardware. Customers are funding this expansion through upfront cash commitments to lock in multiyear production space.
Since 2025, Amkor has executed advance payment arrangements with a dozen customers, primarily supporting advanced packaging capacity across both Korea and Arizona, and there are several more customer agreements under discussion.
-- Megan Faust, Chief Financial Officer
Data center demand is driving expansion in High-Density Fan-Out (HDFO), an advanced packaging technique that connects chips closely, and 2.5-dimensional (2.5D) packaging, which places dies side by side. These high-value platforms are lifting overall profit margins.
Our flagship HDFO CPU program is scaling. An additional HDFO CPU program for a hyperscaler began ramping in Q3 and 2 new 2.5D programs in networking and data center are expected to come online in Q4.
-- Kevin Engel, Chief Executive Officer
Shifting lower-margin System-in-Package (SiP), a technology combining multiple components into a single module, from Korea to Vietnam is freeing clean room space. Amkor is filling that space with higher-margin advanced packaging tools for data center customers.
As we migrate SiP from Korea to Vietnam, we are opening up needed clean room space in Korea for additional advanced packaging growth. The released space in Korea is being redeployed and quickly consumed by advanced packaging customers.
-- Kevin Engel, Chief Executive Officer
Computing growth is cushioning broader softness across smartphone and consumer electronics markets, and profit margins are expanding as high-value packaging scales. Amkor holds a turnkey assembly advantage because it integrates design and test strategy across a global footprint.
A richer mix of advanced packaging revenue and strong execution drove meaningful margin expansion. We remain focused on disciplined investment as we position the business for profitable long-term growth.
-- Megan Faust, Chief Financial Officer
Multiyear customer agreements and advance payments reduce capital risk as Amkor expands cleanroom capacity across Arizona, Korea, and Vietnam.
Advanced packaging is driving significant growth opportunities. We continue to make progress across our HDFO and 2.5D programs with strong momentum in AI and high-performance Computing.
-- Kevin Engel, Chief Executive Officer
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