TradingKey - On June 29, during a national briefing at the Blue House in Seoul, South Korean President Lee Jae-myung made an announcement that officially ignited the largest expansion engine in the history of South Korea's semiconductor industry. The South Korean government announced an investment of 800 trillion KRW (approximately 3.52 trillion RMB) to build a brand-new memory chip cluster in the southwestern region. Concurrently, industry giants Samsung Electronics and SK Hynix unveiled long-term investment plans totaling 3,755 trillion KRW—marking the beginning of a global memory industry arms race looking toward the 2030s.
This series of initiatives is not merely a simple expansion of production capacity, but a "mega-project for AI chips" jointly forged by the South Korean government and enterprises. Facing exponential growth in computing power demand in the AI era, South Korea is attempting to consolidate its absolute leadership in the global memory chip market and build an "irreplaceable" industrial competitiveness through large-scale, coordinated investments guided by the government. From the strategic relocation from the capital area to the southwestern region, to the pivot from traditional memory to AI-dedicated HBM chips, this trillion-level investment wave will not only reshape South Korea's semiconductor industry landscape but also profoundly influence the future direction of global AI computing power infrastructure.
This trillion-level chip investment plan led by South Korea is both a bold bet on the demand for computing power in the AI era and an important turning point in the reshaping of the global semiconductor industry landscape. Over the next decade, whether South Korea can consolidate its status as the global memory hegemon through this mega-project, and how the global industrial chain will adapt to this wild surge in capacity, are questions whose answers are gradually emerging alongside the roar of breaking ground in the southwestern region.
The Southwest Semiconductor Cluster planned by the South Korean government will feature the construction of four memory chip fabs in the Gwangju and Jeolla regions, with Samsung Electronics and SK Hynix each building two, focusing on DRAM and HBM memory chips. Originally scheduled for completion in the 2040s, this project has been accelerated to the mid-2030s, significantly shortening the construction cycle by 12 years.
The government will provide infrastructure support including land, electricity, and water. However, BofA Securities analysts pointed out that the infrastructure construction phase alone will take at least 5 years. Combined with fab shell construction, capacity ramp-up, and trial production, the new cluster is expected to achieve meaningful volume production output in 8 to 10 years at the earliest.
Currently, South Korea's existing memory fabs are mainly concentrated around the Seoul metropolitan area, including Pyeongtaek, Yongin, Hwaseong, and Icheon, where a well-established industrial chain and talent ecosystem have formed over years of development. The newly planned Southwest Cluster is located far from Seoul, requiring a much larger scale of infrastructure investment and presenting significantly higher construction difficulty.
BofA Securities likened it to TSMC's decentralization strategy in Tainan, noting that capacity expansion far from core regions requires a longer lead-time preparation period, encompassing electricity supply, water resource security, logistics system construction, and high-end talent recruitment.
Kim Yong-beom, Chief of Staff for Policy in the South Korean Presidential Office, stated that building a semiconductor fab takes approximately 7 to 8 years. It is precisely because of this long cycle that advance planning and deployment are necessary to cope with the exponential growth in chip demand from the AI industry.
With the rapid popularization of AI applications, global demand for memory chips is experiencing explosive growth, particularly with high-end memory products like HBM in short supply. The South Korean government hopes to seize the commanding heights of the future AI memory market through early strategic positioning.
Of the 265.5 trillion Korean won investment plan announced by Samsung Electronics, over 76% of the funds will focus on the semiconductor sector. Specifically, 203 trillion Korean won will be used for the upgrading and renovation of existing industrial clusters in Yongin and Pyeongtaek, further enhancing the capacity efficiency of DRAM and NAND flash memory; 60 trillion Korean won will be directed toward a new wafer fab construction project in Gwangju, where there are plans to build 4 to 5 front-end wafer fabs to form a new growth engine for the industry; meanwhile, Samsung will also participate in an 8.1 trillion Korean won HBM packaging facility investment in South Chungcheong Province, focusing on breaking through high-bandwidth memory chip packaging technology, which is core to the AI era.
Beyond the chip manufacturing segment, Samsung's investment reach also extends to the broader supply chain. The company plans to strengthen its advanced packaging capabilities by building a chip packaging plant in South Chungcheong Province to increase the value-added of high-end memory products; meanwhile, it will increase R&D investment in next-generation memory technologies to ensure it maintains a leading position in future technology iterations. Jay Y. Lee, Chairman of Samsung Group, stated that this investment is an "inevitable choice to respond to the AI era," and the company will build an "unshakeable competitive advantage" through a full industry-chain layout.
Compared to Samsung's full-chain layout, SK Group's 1,100 trillion won investment plan is more focused. Of this, 400 trillion won will be invested in the Gwangju region in southwestern South Korea, with plans to build 4 to 5 front-end wafer fabs here, mainly producing core AI memory chips such as DRAM and HBM.
At the same time, SK Hynix will expand its NAND flash memory plant in Chungcheongbuk-do to increase the capacity scale of flash memory products, and participate in HBM packaging facility investments to strengthen its high-end memory chip manufacturing capabilities.
Notably, SK Hynix filed for a listing with the US SEC on June 24, planning to raise 45.45 trillion won (approximately $29.4 billion) through Nasdaq ADRs, which will be primarily used for capacity expansion and technology R&D.
SK Group Chairman Chey Tae-won stated that the demand for memory chips in the AI era is growing "exponentially," and the company must accelerate its capacity layout to meet customer needs. This listing will provide ample financial support for the company's expansion plans.
The South Korean government expects that this large-scale investment will double the country's DRAM production capacity within five years and drive a fourfold increase in the size of the global memory market.
To achieve this goal, the South Korean government and enterprises are collaboratively advancing a series of core projects: an 800 trillion won Southwest Chip Cluster construction project, which will establish four semiconductor fabs; an 81 trillion won investment in HBM packaging facilities to enhance the packaging capacity of AI memory chips; at least 30 trillion won in R&D investment for next-generation memory technology over the next 15 years to ensure South Korea maintains its lead in technological competition; and over 1,000 trillion won for AI data center construction by 2035 to build a robust computing power infrastructure.
This series of goals directly targets the computing power demands of the AI era, aiming to construct a complete ecological chain ranging from chip manufacturing to computing power infrastructure and terminal applications. Kim Jeong-kwan, South Korea's Minister of Trade, Industry and Energy, stated that South Korea must seize the initiative in the AI industry through a "speed strategy" to build "irreplaceable industrial competitiveness."
This large-scale expansion by South Korean memory giants is no accident, but rather the result of multiple factors working together.
First is the strategic positioning required in the AI era. As AI technology drives exponential growth in computing power, the demand for High Bandwidth Memory (HBM) is exploding, forcing Samsung and SK Hynix to establish early positions to capture market share.
Second is the need to alleviate the pressures of industrial concentration. South Korean chip manufacturing has long been concentrated around the Seoul metropolitan area, where power and water supply capacities are nearing their limits. The new locations in the southwestern region will open up new space for development.
Furthermore, the global AI race has evolved into a competition between nations, and South Korea must act faster than its competitors.
At the same time, this expansion is backed by financial strength. The record-breaking financial performances of both companies in the first quarter of 2026 have provided a solid foundation for large-scale investment, with SK Hynix's single-quarter operating profit margin exceeding 72%, and Samsung Electronics maintaining its position as the global leader in both basic DRAM and NAND memory.
South Korean memory chipmakers have reaffirmed plans to nearly double their DRAM wafer capacity by 2030. On the surface, this expansion appears substantial, corresponding to a compound annual growth rate (CAGR) of approximately 15%.
However, BofA Securities points out in its analysis that when factoring in the closure of older fabs and the longer manufacturing cycles required for next-generation memory chips, the actual expansion rate of operational wafer capacity will be below 10% annually. The overall net wafer growth rate is projected to be only a single-digit percentage CAGR through 2030. Even if the construction of new fabs in Yongin and Pyeongtaek accelerates, it is unlikely to drive any significant near-term increase in memory output.
This implies that any shift in the supply-demand balance of the memory market in the short term will rely more heavily on demand-side variables. Xu Jiayuan, an analyst at TrendForce, noted that since mass production at the new fabs is mostly scheduled for the second half of 2027 to 2028, the supply-deficit pattern for DRAM remains difficult to reverse before then.
The core of South Korea's capacity expansion this time is HBM memory chips. Samsung and SK Hynix control nearly 80% of the global HBM market share. Currently, their capacity has been locked in advance by customers like Nvidia, meaning the expansion is primarily aimed at meeting committed, long-term order demands.
Notably, AI-driven demand for memory chips is undergoing structural changes. The demand for HBM from AI servers is three to four times that of traditional consumer-grade memory, and the current global HBM supply remains tight. With Samsung and SK Hynix's HBM capacity already locked in advance by customers like Nvidia, failing to expand capacity would leave them unable to meet customer demand, and could even result in a loss of market share. Therefore, this expansion is more of an inevitable response to market demand rather than blind expansion.
As the trillion-won investment plans of South Korea's two major memory giants are finalized, a global memory arms race geared toward the 2030s has officially begun.
This unprecedented expansion of production capacity is not only a strategic choice for South Korean companies to consolidate their global leadership, but also an inevitable outcome of the explosive demand for computing power in the AI era. Although it cannot alter the supply and demand dynamics of the memory market in the short term, it signals the South Korean government's clear intention to strongly support the long-term expansion of its domestic memory industry, helping to bolster market confidence in the long-term competitiveness of South Korean memory chipmakers.